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BD1603NUV
Datasheet
10. Cautions on PCB Design
BD1603NUV is equipped with a double charge pump. As the load current becomes larger, the input current also becomes
larger.
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Wire a substrate in a way that the wiring impedance can be minimized. Special care should be taken for the input
voltage, ground, output and flying capacitor connection pin.
Wire the ground of an output capacitor (C OUT ) near the GND pin of this LSI.
Position a bypass capacitor to be inserted between V IN (input voltage) and GND near this LSI and wire it near the
VIN and GND pins of this LSI.
Heat radiation is controlled by the wiring status to the back metal. Connect it with GND plane as much as
possible by a wide area.
About the FSEL terminal and the VSEL terminal, process fixed logic by the PCB pattern when using it by fixed
logic.
V IN
V OUT
BD1603NUV
C OUT
GND
Figure 19. How to Ground in PCB Design
www.rohm.com
? 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
9/12
TSZ02201-0G3G0C200040-1-2
17.Dec.2012 Rev.001
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